Industrial tool
Our ADE Single Side Etch Serie industrial tools deliver throughput values beyond the current industry roadmap, with low cost of ownership. UNIVERSAL single side etching equipment and process for any type of silicon wafer or layer; a trully future-proof solution.
Our tools are designed using multiple parallel lines of processing and atmospheric pressure chemical reactors similar to the one used in our development tool. The industrial process is compatiable with on-site generation of the etching gas, delivering even lower cost of ownership.
Designed for single side etching of poly-silicon layers, the ADE SS POLY-ETCH is especially suited for TOPCON solar cells and other advanced solar cell architectures using passivated contacts.
A new addtion to the ADE tool plateform, the ADE SS E-ETCH will be specifically developped for the single side edge isolation cell process at ultra-high throughput.
** In development ** New nano-texturing process designed for single side texturing of silicon wafers. The ADE SS nano-TEX will be developped to suit the needs of tandem devices bottom cells and Perovskyte deposition.
> Very small footprint
Modular multi-lanes configurations.
The ADE SS Poly-ETCH can remove selectively and at very high etch rate the few hundreds of nanometres of a-Si or poly-silicon from one side of the wafer.
- Non-metallic soft handling conveyor
- Low temperature process
- Multi-lane Modular Design: Up to 3,000 wafer/hour/lane
- Up to 24,000 wph Tool Throughput
- Configurations for all wafer sizes up to G12
- M10 : 2 x 4 lanes configuration
- G12 : 2x 3 lanes configuration
- Fully automated - Integrated safety matrix
- Very low power consumption
- Low COO
- DOES NOT NEED ANY D.I. WATER
Low reflectivity texture: Outperforming industry standards with wafer surface reflectivity Rw values adjustable to lower levels.
In-line, scalable process
Inline process, high throughput, and on-site generation of etching gases facilitate scalability of the manufacturing process.
NO Green House Gases
Improves the overall sustainability of the manufacturing process; process without any Green House Gases (GHG)resulting in Zero Global Warming Potential (GWP).
Mask-less, single-side processing
The wafer's rear side is preserved. Enables advanced cell architectures, simplify process flow, whilst also reducing processing costs.
